High-Precision Measuring Microscope with XYZ Moving Stage for Semiconductor Package Inspection
The MC-A200B High-Precision Measuring Microscope with XYZ Moving Stage is a professional optical measurement system designed for semiconductor package inspection, PCB measurement, and precision component analysis. Combining a high-resolution CCD camera, precision XYZ stage, long working distance optics, and advanced measurement software, it enables accurate non-contact measurement of microscopic structures.
With 0.1 μm resolution on X, Y, and Z axes, the system supports precise 2D dimensional measurement as well as height and depth measurement for applications such as IC packages, solder bumps, wire bonding, and electronic components.
Supporting multiple observation modes including brightfield, darkfield, polarized light, and optional DIC imaging, the MC-A200B provides flexible inspection solutions for quality control, research, and production environments.
What Is a Measuring Microscope with XYZ Moving Stage?
A measuring microscope with XYZ moving stage is a high-precision non-contact optical measurement system that combines advanced microscopy, precision positioning technology, and professional measurement software to perform accurate 2D dimensional measurement, height measurement, and depth analysis. Unlike conventional inspection microscopes that provide only visual observation, it enables engineers to obtain reliable measurement data for microscopic structures with high accuracy and repeatability.
By integrating a precision XYZ coordinate stage, high-resolution imaging system, and intelligent measurement software, the microscope allows users to measure points, lines, circles, angles, geometric features, and height differences across complex components. The Z-axis focusing system provides precise vertical positioning, making it possible to perform non-contact height and depth measurement for applications requiring three-dimensional inspection.
Widely used in semiconductor package inspection, PCB inspection, electronic component measurement, precision machining, and quality control, XYZ measuring microscopes provide fast, repeatable, and reliable measurement solutions for advanced manufacturing environments.
Understanding the role of each measurement axis is essential when selecting an XYZ measuring microscope. Learn more about what X, Y, and Z axes can measure, from planar dimensions and feature positions to height, depth, and step-height measurements.
Why Semiconductor & Precision Manufacturing Require XYZ Measurement
As semiconductor packages become smaller and more complex, manufacturers need reliable measurement solutions beyond visual inspection. Structures such as solder bumps, bonding wires, package edges, and PCB features require accurate dimensional verification to ensure quality and process stability.
The MC-A200B combines high-resolution imaging with precision XYZ coordinate measurement, providing engineers with both detailed observation and quantitative measurement results.
- Micron-Level Measurement Accuracy
- XYZ Axis Coordinate Measurement
- Non-Contact Optical Inspection
- Semiconductor Package Inspection
- Non-Contact Surface Evaluation
- Flexible Optical Observation
- Repeatable Quality Control
Advanced Optical Observation Technologies for Accurate Measurement
The MC-A200B Measuring Microscope supports multiple observation modes, including brightfield, darkfield, polarized light, and optional DIC imaging. These advanced optical technologies improve image contrast, surface visibility, and measurement accuracy for semiconductor packages, PCB components, and precision parts.
Brightfield & Darkfield Illumination for Surface Inspection
The MC-A200B supports both brightfield and darkfield illumination for flexible inspection of different materials and surface conditions.
Brightfield illumination provides clear, high-contrast images for dimensional measurement of IC packages, PCB components, and precision parts.
Darkfield illumination enhances surface irregularities, helping identify fine defects such as scratches, particles, cracks, and edge abnormalities.
With adjustable illumination intensity, the system ensures stable imaging performance for accurate optical measurement.
Polarized Light Observation for Material Analysis
Polarized light observation improves image contrast when inspecting materials with optical properties such as birefringence or internal stress.
By using polarized illumination, the MC-A200B can reveal details that may not be clearly visible under conventional lighting, including:
- Material stress patterns
- Transparent or semi-transparent structures
- Surface variations
- Optical characteristics of precision components
This observation method is particularly useful for semiconductor materials, electronic components, optical parts, and research applications where material characteristics need to be analyzed during inspection.
DIC Differential Interference Contrast Imaging for Fine Surface Details
DIC (Differential Interference Contrast) imaging is an advanced optical technique that enhances subtle surface variations by converting small height differences into visible contrast changes.
Compared with standard brightfield observation, DIC provides improved visualization of fine surface structures, making it useful for detecting:
- Micro scratches
- Shallow surface defects
- Fine edges
- Small structural variations
For semiconductor packaging and precision manufacturing, DIC imaging helps engineers observe microscopic details and improve inspection confidence when analyzing complex components.
Why Choose MC-A200B for High-Precision XYZ Measurement?
The MC-A200B is designed for manufacturers that require accurate measurement, reliable inspection, and flexible optical observation in demanding production environments. Combining precision mechanics, advanced optics, and intelligent measurement software, it provides a complete solution for semiconductor packages, electronic components, and precision manufacturing applications.
High-Precision XYZ Axis Measurement System
The MC-A200B features a precision XYZ measurement system with 0.1 μm resolution on X, Y, and Z axes. The high-accuracy stage enables reliable coordinate measurement, positioning, and height analysis for microscopic structures and precision components.
Motorized Z-Axis Focusing for Height Measurement
The motorized Z-axis focusing system provides precise vertical movement for non-contact height and depth measurement. It allows engineers to analyze step heights, package structures, grooves, and surface variations without damaging sensitive samples.
Multiple Optical Observation Modes
Supporting brightfield, darkfield, polarized light, and optional DIC imaging, the MC-A200B adapts to different materials and inspection requirements. Multiple illumination methods improve image contrast and help users identify surface details, defects, and structural features.
Large Measuring Stage for Flexible Inspection
The MC-A200B features a 400 mm × 280 mm large measuring stage for stable inspection of semiconductor packages, PCB assemblies, and precision components. For larger samples or customized applications, MCscope also provides optional stage sizes, including 500 mm × 350 mm, 500 mm × 450 mm, and 600 mm × 450 mm, while maintaining precise XYZ measurement performance.
Long Working Distance Optical System
The infinity long working distance semi-apochromatic objective design provides clear, high-resolution images while maintaining sufficient space for complex samples. It is ideal for semiconductor packages, PCB assemblies, and precision components with varied structures.
Professional Measurement Software with Automatic Detection
The integrated measurement software supports point, line, circle, angle, and standard geometric measurement. With digital image processing and automatic edge detection, engineers can achieve faster measurement workflows and improved repeatability.
| Parameter | Specification |
|---|---|
| Measurement Type | Non-contact Optical Measurement |
| Measurement Axes | XYZ Precision Measurement |
| Focus System | Motorized Z-axis Focusing |
| Focus Resolution | 0.1 μm |
| Measurement Repeatability | ±1 μm |
| Measurement Accuracy | (3 + 0.02L) μm |
| Maximum Sample Height | 200 mm |
| Stage Measurement Range | 200 mm × 150 mm |
| Standard Metal Stage Size | 400 mm × 280 mm |
| Objective Lenses | Infinity Long Working Distance Semi-Apochromatic Objectives: 5X / 10X / 20X / 50X |
| Camera Resolution | 12 Megapixels |
| Image Resolution | 4000 × 3000 |
| Observation Modes | Brightfield, Darkfield, Polarized Light, Optional DIC |
| Illumination System | Telecentric Transmitted Illumination & Reflected Brightfield/Darkfield Illumination |
| Measurement Software | OMT-1.5D with Point, Line, Circle, and Standard Geometry Measurement |
| Optional Configuration | Customized illumination options including Brightfield, Darkfield, Polarized Light, and DIC observation modes |
| Custom Stage Options | Available with larger metal stage sizes: 500 mm × 350 mm, 500 mm × 450 mm, and 600 mm × 450 mm |
Watch the MC-A200B Measuring Microscope in Action
See the MC-A200B in action for precise inspection and measurement of semiconductor packages and precision components. The video demonstrates XYZ positioning, 2D dimensional measurement, and Z-axis height measurement for microscopic edges, steps, and structural features.
Solving Precision Measurement Challenges in Semiconductor Inspection
Power Module Inspection & Chip Height Measurement
Application Scenario
A power semiconductor manufacturer needed a precision measurement solution for power module inspection, including DBC ceramic substrates, semiconductor dies, wire bonding structures, and chip height differences.
Inspection Challenge
Power modules contain multiple chips, bonding wires, and metallic pads across different height levels. Conventional visual inspection can show these structures but cannot reliably quantify vertical dimensions or distances between critical features.
MC-A200B Solution
The MC-A200B XYZ Measuring Microscope combines high-resolution imaging, precision XYZ positioning, and motorized Z-axis focusing for non-contact measurement. Engineers can measure chip height, die positioning, wire bond dimensions, and pad-to-chip distances with high repeatability.
The solution supports quality control in power semiconductor manufacturing, IGBT/MOSFET module inspection, DBC substrate inspection, and electronic packaging.
Lead Frame Height Measurement for Semiconductor Inspection
Application Scenario
A semiconductor manufacturer required an accurate and efficient method to measure the height difference between the upper and lower surfaces of lead frame structures during production inspection.
Inspection Challenge
While conventional microscopes can clearly observe lead frame surfaces, measuring the vertical distance between two surfaces requires precise Z-axis positioning and repeatable reference points.
MC-A200B Solution
The MC-A200B Measuring Microscope uses motorized Z-axis focusing to perform non-contact height measurement. The operator establishes the upper surface as the reference point, then moves to the lower surface and records the Z-axis displacement to obtain the lead frame height.
This provides a simple and repeatable solution for lead frame inspection, semiconductor package measurement, height measurement, and production quality control.
Need Help Finding the Right XYZ Measuring Microscope?
From semiconductor packages to precision components, our experts can help you select the right XYZ measuring microscope configuration based on your sample, measurement requirements, and inspection workflow.
Real-World Industry Applications of Extended Depth of Field Microscopes
The MC-HX1000 provides fully focused imaging and precision optical inspection for industries that require accurate observation of complex microscopic structures. Its extended depth-of-field technology and integrated measurement software improve inspection efficiency across electronics manufacturing, semiconductor production, precision engineering, and industrial research.
The MC-A200B supports semiconductor inspection with high-precision 2D measurement and Z-axis height measurement of semiconductor structures and components. Engineers can verify critical dimensions, surface features, and height differences for semiconductor manufacturing and quality control.
Typical applications:
- Semiconductor structure measurement
- Wafer feature inspection
- Height and dimensional measurement
Designed for semiconductor package inspection, the MC-A200B enables accurate measurement of IC packages, lead frames, bonding structures, and other critical features. Its XYZ positioning and motorized Z-axis focusing support reliable dimensional and height inspection.
Typical applications:
- IC package measurement
- Lead frame height measurement
- Wire bonding inspection
The MC-A200B provides precise optical measurement for PCBs and electronic components. Engineers can measure component dimensions, distances, edges, and height differences for production inspection and quality control.
Typical applications:
- PCB feature measurement
- Electronic component inspection
- Solder joint dimensional inspection
The MC-A200B supports precision inspection of power semiconductor modules used in electric vehicles and advanced electronic systems. It enables non-contact measurement of IGBT and SiC power modules, chip height, bonding structures, and DBC substrates for production quality control.
Typical applications:
- EV power module inspection
- IGBT & SiC module measurement
- DBC substrate and chip height inspection
For precision-machined parts, the MC-A200B provides high-resolution observation and accurate XYZ measurement of complex mechanical features. It helps engineers inspect dimensions, steps, grooves, edges, and surface structures without contacting the sample.
Typical applications:
- Precision machined part inspection
- Groove and step measurement
- Metal component dimensional inspection
The MC-A200B supports optical inspection and dimensional analysis of materials with different surface and optical characteristics. Brightfield, darkfield, polarized light, and optional DIC observation help reveal surface features, defects, and structural variations.
Typical applications:
- Material surface inspection
- Glass and display panel inspection
- Surface defect and structure analysis
XYZ Measurement Guides & Technical Resources
Introduction Wire bond inspection is often associated with checking whether a bonding wire or bond looks normal under magnification. However,
Introduction When a small component needs to be inspected under a microscope, the first question is often about magnification: How
Introduction An XYZ measuring microscope combines microscopic imaging with precision positioning and dimensional measurement along three coordinate directions: X, Y,
Introduction A measuring microscope is an optical inspection system that combines magnified imaging with dimensional measurement. Unlike a conventional microscope
Introduction Modern manufacturing is moving toward smaller components, tighter tolerances, and more complex surface structures. In industries such as electronics
Introduction In modern manufacturing, quality control depends on more than measuring length, width, and diameter. Many critical product characteristics are
FAQ About XYZ Measuring Microscopes
An XYZ measuring microscope combines precision X, Y, and Z positioning with high-resolution optical imaging for accurate dimensional, height, and depth measurement of microscopic features.
The MC-A200B can measure points, lines, circles, angles, distances, geometric features, and vertical height differences. It is suitable for both 2D dimensional and Z-axis height measurement.
Yes. Its motorized Z-axis focusing system enables non-contact height and depth measurement of features such as steps, grooves, lead frames, semiconductor packages, and component structures.
The MC-A200B is widely used for semiconductor inspection, IC package inspection, power module inspection, PCB inspection, electronic components, precision machining, and display panel inspection.
The system can be configured with brightfield, darkfield, polarized light, and optional DIC observation to improve contrast and visibility for different materials and surface structures.
The standard measurement accuracy is (3 + 0.02L) μm, where L represents the measured length. The focus resolution can reach 0.1 μm, with measurement repeatability of ±1 μm.
Yes. Stage dimensions, illumination configurations, observation modes, and other system components can be customized according to sample size, measurement requirements, and inspection workflow.