MC-HD3003 Focus Stacking All-in-One Digital Microscope | OEM Industrial Microscope
MC-HD3003 Focus Stacking All-in-One Digital Microscope
MC-HD3003 offers depth-of-field stacking and calibration-free measurement in an integrated platform. It’s ideal for complex surface inspections where sharpness across height differences is critical.
- 1920×1080P @60FPS resolution
- Depth-of-field stacking function
- Smart edge detection & calibration-free measurement
- Dual output: HDMI + Ethernet port
- Embedded LED lighting
- Supports optional 3D module
Operating System: Linux 3.10
Processor: Dual-core Cortex-A9 @1GHz
Image Sensor: 1/2″ CMOS
Resolution: 1920×1080P @ 60FPS
Optical Zoom: 0.7–5X continuous zoom
Digital Zoom: 7–230X adjustable
Lighting: Embedded high-power LED light source
Data Output: Measurement images + Excel export
Control Method: Mouse operation (smart/manual point selection)
Output: USB + Ethernet port9
Image Adjustment: Exposure, white balance (WB), RGB tuning, HDR (wide dynamic range), edge enhancement
Key Features: Calibration-free measurement, automatic edge finding, image stacking, glare suppression, depth of field stacking function
Watch MCscope All-in-One Digital Microscope Demos in Action
Watch short clips of our all-in-one microscopes in action—demonstrating real-world inspections of PCBs, electronic components, microchips, and semiconductor wafers.
MCscope All-in-One Microscope Demos
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What Is the Focus Stacking Function?
Focus stacking is a digital imaging technique that combines multiple images taken at different focal depths into one fully focused image. This is especially useful when inspecting objects with uneven surfaces or varying heights, such as electronic components, machined parts, or biological samples. By stacking the sharpest areas from each image, the final result displays maximum clarity across the entire field of view.
How Does It Work?
- The microscope captures a series of images at different focus levels automatically or manually.
- Each image contains a different area of the object in focus—top, middle, or bottom surfaces.
- The system uses an algorithm to extract the sharpest regions from each image.
- These regions are then combined into one image with extended depth of field.
- The final image presents a fully focused view from front to back, eliminating blur caused by limited depth of field.
Key Advantages
- Capture complex surfaces clearly – Enables full clarity on multi-layered or uneven samples such as PCBs, fibers, or molds.
- Reduce manual refocusing – Saves time by eliminating the need to constantly adjust focus during inspection.
- Improve accuracy in analysis – Ensures that all critical features are visible in one image, enhancing documentation and reporting.
- Enhance visual presentation – Ideal for generating professional-grade images for quality reports, training, or client presentations.
- Streamline workflow – Greatly improves inspection speed and consistency for production and lab environments.
| Feature | MC-HD3000 | MC-HD3000A | MC-HD3002 | MC-HD3003 |
|---|---|---|---|---|
| Resolution | 1080P@60FPS | 4K@60FPS | 1080P@60FPS | 1080P@60FPS |
| Autofocus |  No |  Yes | No | No |
| Depth Stacking | No | No | Yes | Yes |
| Calibration | Free | Required | Free | Free |
| Video Recording | Photos only | Yes | Yes | Yes |
| External Monitor | Yes | Yes | Yes | Yes |
| Computer Connection | No | Yes | Yes | Yes |
| 3D Module Support | Yes | Yes | No | Yes |
| Digital Magnification | 7-230X | 7-230X | 20-150X | 7-230X |
| Lighting System | Ring Light | Ring Light | 8-zone LED | Ring Light |
All-in-One Digital Microscope Comparison Table
Sample Images from MCscope All-in-One Digital Microscope
PCB and Electronics Inspection
• Reveal multiple surface levels on uneven PCBs in full focus using depth stacking.
• Clearly identify solder bridges, lifted leads, and component alignment issues.
• Ensure trace continuity and pad condition without repeated refocusing.
Semiconductor and Wafer Analysis
• Observe bonding wires, wafer edges, and micro-features all in one clear image.
• Detect defects across varying focal planes like cracks, residue, or deformation.
• Improve efficiency in chip-level inspection with consistent depth clarity.
Precision Mold and Plastic Part Verification
• Inspect complex molded parts where surface height varies across the structure.
• Visualize edge sharpness, flash defects, and micro-holes without shifting focus.
• Measure features accurately using clear, all-in-focus images of curved surfaces.
Metallography and Material Science
• Inspect catheters, stents, or surgical tools with varied surface depths.
• Capture deformation, cracks, or connection joints at different focus levels.
• Facilitate defect detection and measurement on intricate medical parts.
Watchmaking and Jewelry Quality Control
• Assess multi-layer engravings, gear teeth, and gemstone inclusions in full focus.
• Reveal polishing marks, tool scratches, or surface inconsistencies with clarity.
• Eliminate refocusing delays when examining textured or contoured surfaces.
Medical Device and Micro-Component QA
• Inspect catheters, stents, or surgical tools with varied surface depths.
• Capture deformation, cracks, or connection joints at different focus levels.
• Facilitate defect detection and measurement on intricate medical parts.
