2D vs 3D Measurement Microscopes: What Is the Difference?

Introduction When a small component needs to be inspected under a microscope, the first question is often about magnification: How large does the image need to be? For dimensional inspection, however, magnification is only part of the problem. An engineer may need to measure the diameter of a solder ball, the width of a PCB […]

Measuring Microscope for Semiconductor Package Inspection

MC-A200B XYZ measuring microscope DIC observation of semiconductor wafer surface

Introduction Semiconductor packages are becoming smaller, denser, and more structurally complex as electronics manufacturers adopt advanced packaging, finer interconnects, stacked dies, miniaturized wire bonds, micro-bumps, and other high-density structures. At the same time, inspection requirements are moving beyond simple visual defect detection. For engineers working in semiconductor packaging, a package may need to be inspected […]

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