Blind Via Inspection Guide: Common Challenges, Defects and 3D Inspection Solutions
Introduction As PCB designs continue to evolve toward higher density and greater functionality, blind vias have become an essential feature in modern electronics manufacturing. They enable more compact circuit layouts, shorter signal paths, and improved electrical performance, making them widely used in HDI (High-Density Interconnect) PCBs, smartphones, automotive electronics, communication equipment, and advanced semiconductor packaging. […]