BGA Inspection Guide: Common Defects, Inspection Challenges and 3D Microscope Applications
Introduction Ball Grid Array (BGA) packaging has become one of the most widely used semiconductor packaging technologies in modern electronics manufacturing. Compared with traditional leaded packages, BGAs provide higher pin density, improved electrical performance, better thermal dissipation, and a smaller package footprint. As a result, they are extensively used in smartphones, automotive electronics, industrial control […]